The University of Arkansas Power Group congratulates Tijesunimi Akintunde on presenting his research at the IEEE ITherm 2026 conference in Orlando, Florida, one of the leading international conferences focused on thermal management and electronics cooling.
At the conference, Akintunde presented his paper, “Thermal Characterization of Thin-Film Ceramics Using a Liquid-to-Liquid Heat Exchange Method,” which introduces a new method for evaluating the thermal resistance of thin-film ceramic-on-cold-plate assemblies in power electronics. He also engaged with researchers and industry leaders to discuss emerging technologies in chip-level cooling, thermal management, and high-power electronics.
