Dr. David Huitink and his team were named a Phase One winner in the U.S. Department of Energy’s Silicon Carbide Packaging Prize. Their innovative design, led by Dr. Huitink in collaboration with Dr. Xiaoqing Song and graduate students Matthew Norris, Mohammad Dehan Rahman, and Tanzila Akter pushes semiconductor packaging limits, enabling silicon carbide devices to handle higher temperatures and power levels in an ultra-compact form. One of eight Phase 1 winners, the team received $50,000 to build a prototype for Phase 2, where they’ll compete for one of four $250,000 prizes. Click here to watch submission video.
$3.5M Award Boosts Power Electronics Research at U of A
The University of Arkansas has secured a $3.5 million award from the National Institute of Standards and Technology to elevate its roles as a leader in power-electronics research and development. The funding will support upgrades to the High Density Electronics Center...
