Dr. David Huitink and his team were named a Phase One winner in the U.S. Department of Energy’s Silicon Carbide Packaging Prize. Their innovative design, led by Dr. Huitink in collaboration with Dr. Xiaoqing Song and graduate students Matthew Norris, Mohammad Dehan Rahman, and Tanzila Akter pushes semiconductor packaging limits, enabling silicon carbide devices to handle higher temperatures and power levels in an ultra-compact form. One of eight Phase 1 winners, the team received $50,000 to build a prototype for Phase 2, where they’ll compete for one of four $250,000 prizes. Click here to watch submission video.
Engineers Can Earn CEU Credits Through New Online Courses
Professional engineers and graduate students can enroll in a new, online course that offers a foundational understanding of analyzing and designing grid-connected power electronic circuits for electric energy conversion and control. The Grid-connected Advanced Power...
