The University of Arkansas has secured a $3.5 million award from the National Institute of Standards and Technology to elevate its roles as a leader in power-electronics research and development. The funding will support upgrades to the High Density Electronics Center (HiDEC) and establish it as a Power Packaging Center of Excellence, enhancing the university’s capabilities in advanced semiconductor packaging, a key technology for everything from electric vehicles to data centers. The investment strengthens Arkansas’s position in cutting-edge R&D and expands partnerships with industry and government.
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$3.5 Million Award to Advance Power Device and Electronic Module R&D
UA receives $3.5 million for electronics research, facility upgrades
UA Receives $3.5M Award to Advance Power Device and Electronic Module R&D
