Dr. David Huitink and his team were named a Phase One winner in the U.S. Department of Energy’s Silicon Carbide Packaging Prize. Their innovative design, led by Dr. Huitink in collaboration with Dr. Xiaoqing Song and graduate students Matthew Norris, Mohammad Dehan Rahman, and Tanzila Akter pushes semiconductor packaging limits, enabling silicon carbide devices to handle higher temperatures and power levels in an ultra-compact form. One of eight Phase 1 winners, the team received $50,000 to build a prototype for Phase 2, where they’ll compete for one of four $250,000 prizes. Click here to watch submission video.
U of A Collaborates with Defense Department to Develop Video Tracking Tool
The University of Arkansas has joined a nationwide research team funded by the Defense Advanced Research Projects Agency (DARPA) to develop next-generation video object tracking technology. Led by electrical engineering and computer science assistant professor and UA...
