Dr. David Huitink and his team were named a Phase One winner in the U.S. Department of Energy’s Silicon Carbide Packaging Prize. Their innovative design, led by Dr. Huitink in collaboration with Dr. Xiaoqing Song and graduate students Matthew Norris, Mohammad Dehan Rahman, and Tanzila Akter pushes semiconductor packaging limits, enabling silicon carbide devices to handle higher temperatures and power levels in an ultra-compact form. One of eight Phase 1 winners, the team received $50,000 to build a prototype for Phase 2, where they’ll compete for one of four $250,000 prizes. Click here to watch submission video.
$1 Million Awarded to Boost Semiconductor Workforce Development
The University of Arkansas received a $1 million grant from the Arkansas Department of Higher Education to expand workforce training in electronics and semiconductors. This program will equip students with foundational skills for careers in the semiconductor industry,...
