Dr. David Huitink and his team were named a Phase One winner in the U.S. Department of Energy’s Silicon Carbide Packaging Prize. Their innovative design, led by Dr. Huitink in collaboration with Dr. Xiaoqing Song and graduate students Matthew Norris, Mohammad Dehan Rahman, and Tanzila Akter pushes semiconductor packaging limits, enabling silicon carbide devices to handle higher temperatures and power levels in an ultra-compact form. One of eight Phase 1 winners, the team received $50,000 to build a prototype for Phase 2, where they’ll compete for one of four $250,000 prizes. Click here to watch submission video.
Inside MUSiC: Dr. Alan Mantooth on Silicon Carbide Innovation
In this podcast, Dr. Alan Mantooth discusses how Arkansas is emerging as a leader in silicon carbide research and manufacturing. He explores the state’s growing role in advanced power‑electronics innovation and the impact MUSiC will have on U.S. semiconductor...
