High Density Electronics Center (HiDEC) hosted another Wire Bonding Workshop, continuing their effort to bridge the gap between academia and industry through hands-on training. Participants gained real-world experience with the tools and techniques used in advanced packaging, building practical skills that go far beyond the classroom.
Alan Mantooth Announced as National Academy of Inventors Fellow
Congratulations to Alan Mantooth, Distinguished Professor of Engineering at the University of Arkansas and Director of the UAPG, on his recent announcement as a Fellow of the National Academy of Inventors (NAI). The NAI is a prestigious membership organization...
