High Density Electronics Center (HiDEC) hosted another Wire Bonding Workshop, continuing their effort to bridge the gap between academia and industry through hands-on training. Participants gained real-world experience with the tools and techniques used in advanced packaging, building practical skills that go far beyond the classroom.
The UAPG was Awarded 2 External Funding Excellence Awards
The UAPG received both a Pinnacle Medal and a Distinction Medal from the Provost’s Office during the EXCEL‑AR External Funding Excellence Celebration Program for their success securing funding for MUSiC and for their project, “Delivering Advanced Electronics Education...
