The University of Arkansas has secured a $3.5 million award from the National Institute of Standards and Technology to elevate its roles as a leader in power-electronics research and development. The funding will support upgrades to the High Density Electronics Center (HiDEC) and establish it as a Power Packaging Center of Excellence, enhancing the university’s capabilities in advanced semiconductor packaging, a key technology for everything from electric vehicles to data centers. The investment strengthens Arkansas’s position in cutting-edge R&D and expands partnerships with industry and government.
UA Power Group Featured at SEMICON West
The University of Arkansas Power Group represented the University of Arkansas at SEMICON West in October, engaging with industry leaders and showcasing its research, facilities, and industry partnerships in power electronics and semiconductor technologies. Coverage of...
